NEC Electronics Extends Its Portfolio of Leading PowerMOSFET with Industry’s Smallest-in-Class Devices

New uPA2350/51 PowerMOSFET Enable Designers of Portable Systems to Develop Smaller and Thinner Batteries

DÜSSELDORF (Germany), KAWASAKI (Japan) and SANTA CLARA (USA) — 11 Jul 2006

NEC Electronics today announced it has extended its portfolio of low-voltage power management devices (PMD) to include two new power metal-oxide semiconductor field-effect transistors (MOSFET) that boast the industry’s smallest-in-class footprint. The new uPA2350 and uPA2351 power MOSFET reduce the design footprint of traditional dual N-channel MOSFET for battery-protection applications by as much as 86 % compared to current industry solutions such as the 8-pin thin shrink small-outline package (TSSOP) traditionally used, and are ideal for use in lithium-ion battery packs for portable battery-powered applications such as MP3 players, cell phones and other mobile wireless devices.

“As one of the world’s leading supplier of PowerMOSFET for rechargeable lithium-ion batteries, NEC Electronics is continually looking for ways to reduce the size of this type of battery to make portable devices smaller and more attractive to consumers,” said Minoru Matsuda, general manager, Power Management Devices Division, NEC Electronics Corp. “An innovative use of chip-scale packaging technology allowed NEC Electronics to develop MOSFET that have the industry’s lowest on-state resistance and smallest package to address the stringent battery power and performance requirements of evolving portable consumer electronics products.”

The devices combine NEC Electronics’ fourth-generation UMOS process technology with a chip-on-board packaging technique that results in low on-state resistances of 28 milliohms (uPA2350) and 32 milliohms (uPA2351) to extend battery life. The devices are housed in the industry’s smallest and thinnest package in their class, 1.62 millimeters (mm) square by 0.48 mm thick, which can reduce the size of battery packs in ever-shrinking consumer products such as cell phones, digital cameras and other mobile devices. In compliance with the Restriction of Hazardous Substances (RoHS) directive, both devices, including the bump contacts used to connect the chips to the boards, are completely lead-free. Integrated gate-protection diodes result in lower overall system costs and smaller form factors.

More information about the uPA2350 and the uPA2351 PowerMOSFET and other devices in NEC Electronics offering can be found at http://www.eu.necel.com/products/powermosfet/index.html.

About NEC Electronics Corporation

NEC Electronics Corporation (TSE: 6723) specializes in system LSI semiconductor products for a wide range of applications in the computing, networking, mobile, automotive and digital consumer markets. The company was spun off from NEC Corporation in 2002 and listed on the Tokyo Stock Exchange in 2003. NEC Electronics provides design, development and manufacturing support through its staff of approximately 24,000, from its headquarters in Kawasaki, Japan and 25 worldwide subsidiaries. For more information, please visit www.necel.com

About Sunrise

Sunrise Electronics is the only dedicated franchised distributor in the UK electronics market and provides a high level of technical design support to customers for the whole range of NEC semiconductor products including microprocessors, microcontrollers and ASICs as well as memory and colour LCD panels. The field sales team is technically qualified to ensure total support from design concept through to purchasing.

Sunrise is a direct ship distributor. The majority of shipments are delivered directly to customers from NEC’s own ISO9000 warehouse. This ensures reduced handling, correct packaging; especially for fine pitch surface mount devices requiring vacuum sealing, factory fresh product and timely deliveries.